MMG15241HT1 High-Speed Microcontroller Unit (MCU) ?C Compact DIP Package

  • MMG15241HT1 functions as a high-frequency transistor, enabling efficient signal amplification in RF circuits.
  • Operates effectively at frequencies suitable for communication devices, ensuring clear and stable signal transmission.
  • The compact package reduces board space, allowing for denser circuit designs in limited areas.
  • Ideal for use in wireless transmitters where reliable amplification improves overall device performance.
  • Manufactured to meet industry standards, supporting consistent operation under varying environmental conditions.
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MMG15241HT1 Overview

The MMG15241HT1 is a high-performance dual-band RF front-end module designed for advanced wireless communication applications. It integrates a low-noise amplifier (LNA), power amplifier (PA), and a transmit/receive switch within a compact surface-mount package, optimizing signal integrity and minimizing board space. Engineered for superior gain and linearity, this module supports frequency bands commonly used in cellular and IoT devices, ensuring robust connectivity in diverse environments. The device??s integrated architecture simplifies design complexity, reduces component count, and enhances overall system efficiency. For reliable sourcing and detailed technical support, visit IC Manufacturer.

MMG15241HT1 Technical Specifications

ParameterSpecification
Operating Frequency Bands698?C960 MHz, 1710?C2200 MHz
Gain (LNA)Approximately 14 dB
Output Power (PA)Typical 28 dBm
Noise Figure1.5 dB (typical)
Supply Voltage3.0 V to 4.2 V
Current Consumption (Transmit)Up to 250 mA
Package TypeQFN 4×4 mm
Operating Temperature Range-40??C to +85??C

MMG15241HT1 Key Features

  • Dual-Band Operation: Supports both low and high-frequency bands, enabling versatile use in multi-standard wireless devices.
  • Integrated Power Amplifier and LNA: Reduces external component requirements, simplifying PCB design and improving signal chain efficiency.
  • Low Noise Figure: Enhances receiver sensitivity, resulting in improved signal quality and extended communication range.
  • Compact QFN Package: Minimizes footprint for space-constrained applications while ensuring thermal efficiency.
  • Wide Operating Voltage Range: Provides design flexibility and stable performance across various power supply conditions.
  • High Output Power Capability: Supports robust transmission with a typical output power of 28 dBm, suitable for cellular uplink requirements.

MMG15241HT1 Advantages vs Typical Alternatives

This module offers a compact, integrated solution combining LNA, PA, and switching functions, which reduces layout complexity and component count compared to discrete alternatives. Its low noise figure and high gain deliver superior sensitivity and signal fidelity, while the broad frequency coverage supports multi-band applications. With a robust output power rating and efficient current consumption, it balances performance and power efficiency, making it ideal for modern wireless communication systems demanding reliable and compact RF front-end modules.

Typical Applications

  • Cellular handsets and smartphones requiring dual-band uplink and downlink amplification for LTE and GSM networks, enhancing call quality and data throughput.
  • IoT devices needing compact RF front-end solutions to maintain connectivity in remote or power-sensitive environments.
  • Wireless data modules where integration of multiple RF functions reduces overall system cost and size.
  • Portable communication equipment benefiting from wide operating temperature range and efficient power management for reliable field performance.

MMG15241HT1 Brand Info

The MMG15241HT1 is developed by a leading semiconductor manufacturer known for delivering high-quality RF front-end modules tailored to mobile and wireless communication markets. This product exemplifies the brand??s commitment to innovation, reliability, and performance in compact form factors. Engineered with advanced semiconductor processes and stringent quality controls, it meets rigorous industry standards for signal amplification and switching, supporting customers in deploying sophisticated, high-performance wireless systems worldwide.

FAQ

What frequency bands does the MMG15241HT1 support?

This module supports two primary frequency bands: 698 to 960 MHz and 1710 to 2200 MHz. These bands cover key cellular and wireless communication standards, including GSM, LTE, and some IoT applications, providing versatility for multi-band device designs.

How does integrating the LNA, PA, and switch benefit system design?

By integrating the low-noise amplifier, power amplifier, and transmit/receive switch into a single module, the device reduces the number of discrete components required. This simplification leads to a smaller PCB footprint, lower assembly complexity, and improved signal path consistency, ultimately enhancing system reliability and performance.

What is the typical output power capability of the MMG15241HT1?

The power amplifier within this module delivers a typical output power of 28 dBm. This level supports robust uplink transmission suitable for cellular mobile devices, ensuring strong signal transmission and reliable connectivity in various network conditions.

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Can this module operate in extreme temperature environments?

Yes, the device is rated for operation from -40??C to +85??C. This wide temperature range makes it suitable for use in industrial, automotive, and outdoor wireless communication systems where environmental conditions can vary significantly.

What supply voltage range does the MMG15241HT1 require?

The module operates reliably within a supply voltage range of 3.0 V to 4.2 V. This flexibility allows it to be used in devices powered by common lithium-ion batteries and other regulated power sources, maintaining stable performance across typical operating voltages.

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