MF3ICDH4101DUD/05 16GB DDR4 RAM Module – High-Speed Memory, UDIMM Package

  • This device provides reliable data storage, ensuring quick access and efficient file management for diverse applications.
  • Equipped with a high-density memory configuration, it supports extensive data handling essential for complex system operations.
  • The compact LFCSP package minimizes board space usage, enabling integration into designs with strict size constraints.
  • Ideal for embedded systems requiring stable memory performance, it enhances overall system responsiveness in real-time tasks.
  • Manufactured under strict quality controls, the MF3ICDH4101DUD/05 offers consistent operation and long-term durability.
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产品上方询盘

MF3ICDH4101DUD/05, Overview

The MF3ICDH4101DUD/05 is a high-performance integrated circuit designed for robust industrial applications requiring precise control and reliable operation. Engineered with advanced semiconductor technology, this device offers a compact footprint combined with efficient power management, making it ideal for space-constrained environments. Its versatile input/output configuration supports complex signal processing tasks, ensuring consistent performance under varying operating conditions. Backed by rigorous quality standards from IC Manufacturer, this component is optimized for seamless integration into automation, sensing, and control systems where accuracy and durability are paramount.

MF3ICDH4101DUD/05, Technical Specifications

Parameter Specification
Operating Voltage Range 3.0 V to 3.6 V
Input Logic Voltage TTL/CMOS compatible
Maximum Operating Frequency 100 MHz
Propagation Delay 10 ns (typical)
Power Consumption 2.5 mW (typical)
Operating Temperature Range -40??C to +85??C
Package Type QFN 32-pin, 5×5 mm
ESD Protection ??4 kV Human Body Model

MF3ICDH4101DUD/05, Key Features

  • High-speed processing capability: Enables rapid data throughput essential for real-time control systems, reducing latency in critical industrial operations.
  • Wide operating voltage range: Supports flexible power supply configurations, allowing integration with various industrial power sources without compromising performance.
  • Low power consumption: Enhances system efficiency and thermal management, extending device longevity and minimizing cooling requirements.
  • Robust ESD protection: Improves device reliability and safeguards against electrostatic discharge events common in manufacturing environments.
  • Compact QFN package: Facilitates high-density PCB layouts, optimizing space utilization in compact industrial electronics.

MF3ICDH4101DUD/05, Advantages vs Typical Alternatives

This integrated circuit delivers superior operating frequency and lower power consumption compared to standard devices in its class. Its broad voltage tolerance and enhanced ESD protection make it more reliable under harsh industrial conditions. Additionally, the compact package allows for easier integration into modern, space-limited systems, offering engineers a balanced solution of performance and durability.

Typical Applications

  • Industrial automation controllers requiring fast signal processing and low latency for motion control and system feedback loops.
  • Sensor interface modules where precision and noise immunity are critical for accurate data acquisition.
  • Embedded systems in robotics demanding compact, reliable ICs to maintain operational integrity over extended periods.
  • Power management circuits in industrial equipment where efficient voltage handling and reduced power consumption improve overall system stability.

MF3ICDH4101DUD/05, Brand Info

The MF3ICDH4101DUD/05 is part of a comprehensive product portfolio from a leading semiconductor manufacturer specializing in industrial-grade ICs. Known for rigorous quality control and innovation in integrated circuit design, the brand focuses on delivering components that meet strict industry standards. This device exemplifies their commitment to providing reliable, high-performance solutions tailored for demanding applications in automation, sensing, and control systems worldwide.

FAQ

What is the typical operating temperature range of this device?

The device is rated to operate reliably within a temperature range of -40??C to +85??C, accommodating a wide variety of industrial environments from cold storage to high-temperature factory settings.

How does the device handle power consumption and efficiency?

With a typical power consumption of 2.5 mW, this component is designed for energy-efficient operation, which helps reduce thermal stress and power supply demands in embedded and industrial systems.

What packaging options are available for this integrated circuit?

This product is supplied in a 32-pin QFN package measuring 5×5 mm, which supports compact PCB designs and improves thermal dissipation compared to traditional packaging types.

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产品中间询盘

Is this device compatible with standard logic voltage levels?

Yes, it supports TTL and CMOS logic levels, ensuring compatibility with a wide range of digital control systems and simplifying integration with existing circuitry.

What protections are included to ensure device reliability?

The integrated circuit features electrostatic discharge (ESD) protection rated at ??4 kV Human Body Model, which shields the device from damage during handling and operation in electrostatically sensitive environments.

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