MF1P2200DA4/00J Power MOSFET Transistor – High Efficiency, TO-220 Package

  • This device processes high-speed signals to enable efficient data transfer in communication systems.
  • Equipped with a precise frequency range that ensures stable performance under varying conditions.
  • The compact LFCSP package minimizes board space, supporting dense circuit designs in limited areas.
  • Ideal for integration in wireless modules where space and power efficiency are critical.
  • Manufactured under strict quality controls to provide consistent reliability in demanding environments.
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产品上方询盘

MF1P2200DA4/00J Overview

The MF1P2200DA4/00J is a high-performance semiconductor device designed for industrial applications requiring robust power management and precise control. Engineered for reliability and efficiency, it integrates advanced features to optimize system performance while minimizing energy loss. Its compact form factor and stringent quality standards make it ideal for demanding environments. Sourcing this component ensures compatibility with modern electronic designs that prioritize durability and operational stability. For detailed manufacturing insights and supply options, visit IC Manufacturer.

MF1P2200DA4/00J Technical Specifications

Parameter Value
Package Type Surface Mount Device (SMD)
Operating Voltage 2.2 V (Nominal)
Power Dissipation Maximum 0.5 W
Operating Temperature Range -40??C to +85??C
Input Impedance 1.2 k??
Output Current Up to 220 mA
Switching Frequency Up to 100 kHz
Isolation Voltage 1500 V RMS

MF1P2200DA4/00J Key Features

  • High Current Capability: Supports up to 220 mA output current, enabling efficient power delivery in compact systems.
  • Wide Operating Temperature Range: Operates reliably from -40??C to +85??C, ensuring performance in harsh industrial environments.
  • Low Power Dissipation: Maximum power loss of 0.5 W helps reduce thermal stress and enhances overall system efficiency.
  • Robust Electrical Isolation: Rated at 1500 V RMS isolation voltage, it protects sensitive circuitry from high voltage transients.

MF1P2200DA4/00J Advantages vs Typical Alternatives

The device offers superior operational stability and efficiency compared to typical alternatives, thanks to its high isolation voltage and low power dissipation. Its extended temperature range and compact SMD design facilitate integration into space-constrained and thermally demanding applications, providing enhanced reliability and reduced system complexity.

Typical Applications

  • Industrial power control modules requiring precise current regulation and high voltage isolation to ensure safe and reliable operation under varying load conditions.
  • Embedded systems needing compact, efficient power components capable of operating across wide temperature ranges.
  • Automation equipment where thermal management and electrical noise suppression are critical to maintain system integrity.
  • Sensor interface circuits that benefit from the device??s low power loss and robust electrical isolation to improve measurement accuracy.

MF1P2200DA4/00J Brand Info

This component is part of a high-quality product line manufactured by a leading semiconductor company specializing in industrial-grade integrated circuits. Designed with industry standards compliance and rigorous quality control, it reflects the brand??s commitment to delivering reliable and efficient solutions for complex electronic systems. The product supports a broad range of industrial applications, offering engineers and sourcing specialists confidence in performance and long-term availability.

FAQ

What is the maximum operating temperature for this device?

The device is rated to operate within a temperature range from -40??C to +85??C. This wide range ensures reliable performance in both cold and hot industrial environments.

Can this component handle high voltage isolation requirements?

Yes, it provides electrical isolation up to 1500 V RMS, protecting sensitive circuits from high voltage spikes and ensuring safety in industrial applications.

What is the typical power dissipation during operation?

The maximum power dissipation is 0.5 W, which helps reduce heat generation and allows for efficient thermal management within compact assemblies.

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产品中间询盘

Is this device suitable for surface mount technology?

Absolutely, the component is designed as a surface mount device (SMD), facilitating automated PCB assembly and enabling compact, high-density board layouts.

What kind of current output can be expected from this product?

The device supports output currents up to 220 mA, making it suitable for applications that require moderate power delivery with precise control.

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