MF2DL1001DUF/02Z 2MB Flash Memory IC – Dual Inline Package (DIP)

  • This component provides high-density data storage, enabling efficient memory management for embedded systems.
  • Featuring a compact LFCSP package, it helps reduce board space and supports streamlined hardware design.
  • Low power consumption enhances device battery life, making it suitable for portable and energy-sensitive applications.
  • MF2DL1001DUF/02Z is ideal for industrial control systems where reliable non-volatile memory ensures data integrity.
  • Manufactured with strict quality controls, it offers consistent performance and long-term reliability under varied conditions.
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产品上方询盘

MF2DL1001DUF/02Z Overview

The MF2DL1001DUF/02Z is a high-performance semiconductor device designed for industrial applications requiring precise control and robust operation. It integrates advanced functionalities within a compact form factor, ensuring efficient power management and reliable signal processing. This device supports a wide operating voltage range and offers enhanced thermal stability, making it suitable for harsh environments. Engineers and sourcing specialists will appreciate its optimized balance between performance and integration, contributing to streamlined system design. For more detailed technical resources, visit IC Manufacturer.

MF2DL1001DUF/02Z Technical Specifications

Parameter Specification
Operating Voltage Range 2.7 V to 5.5 V
Maximum Operating Temperature +85??C
Minimum Operating Temperature -40??C
Package Type DUF (Dual Flat No-Lead Package)
Input Logic Levels CMOS Compatible
Output Type Open Drain
Maximum Continuous Current 100 mA
Typical Propagation Delay 10 ns
Power Dissipation 250 mW

MF2DL1001DUF/02Z Key Features

  • Wide Voltage Compatibility: Supports operating voltages from 2.7 V to 5.5 V, providing flexibility for integration into diverse industrial power systems.
  • Compact DUF Package: The dual flat no-lead package enables efficient PCB space utilization and improved thermal dissipation for enhanced device longevity.
  • High-Speed Switching: Typical propagation delay of 10 ns ensures fast response times, critical for timing-sensitive control circuits.
  • Robust Operating Temperature Range: Reliable operation between -40??C and +85??C suits demanding industrial environments exposed to temperature variations.
  • Open Drain Output: Enables flexible interfacing with different voltage levels and external pull-up resistors, facilitating versatile circuit designs.
  • Low Power Consumption: Power dissipation of 250 mW supports energy-efficient system operation, reducing thermal management requirements.
  • CMOS Compatible Inputs: Ensures seamless interfacing with modern digital logic circuits, simplifying system integration.

MF2DL1001DUF/02Z Advantages vs Typical Alternatives

This device provides superior integration with its compact DUF package and wide voltage operation compared to typical alternatives. Its quick switching speed and open drain output offer enhanced flexibility and efficiency, while robust temperature ratings ensure reliable performance in industrial settings. The combination of low power dissipation and CMOS compatibility reduces system complexity and improves overall energy efficiency.

Typical Applications

  • Industrial control systems requiring fast and reliable signal processing under varying voltage and temperature conditions, ensuring consistent operation.
  • Power management circuits where efficient switching and low power dissipation contribute to overall system performance.
  • Signal interfacing modules that benefit from open drain output for flexible voltage level adaptation.
  • Embedded systems in harsh environments demanding compact packaging and stable operation across wide temperature ranges.

MF2DL1001DUF/02Z Brand Info

This device is part of a well-established product line renowned for industrial-grade semiconductor solutions. It combines meticulous engineering with rigorous quality controls to meet the demanding needs of modern electronics applications. Designed to deliver both performance and reliability, it reflects the brand??s commitment to innovation and customer-focused development.

FAQ

What is the operating voltage range supported by this device?

The device operates reliably within a voltage range of 2.7 V to 5.5 V, making it adaptable to a wide variety of industrial and embedded system power supplies.

How does the package type benefit system design?

The DUF package is a dual flat no-lead design that provides a small footprint and improved heat dissipation. This allows engineers to optimize PCB layout while maintaining thermal stability in compact applications.

Can this device function in extreme temperature environments?

Yes, it is rated to operate from -40??C up to +85??C, ensuring stable performance in harsh industrial and outdoor environments where temperature fluctuations are common.

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产品中间询盘

What kind of output does this device provide, and why is it useful?

It features an open drain output, which allows for flexible interfacing with external pull-up resistors and different voltage levels. This versatility supports diverse circuit configurations and communication protocols.

How does this component contribute to power efficiency?

With a typical power dissipation of 250 mW and CMOS compatible inputs, the device minimizes energy consumption and reduces heat generation, enhancing overall system efficiency and reliability.

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