MF0AES2001DUFZ High-Speed Amplifier IC – Surface Mount Package

  • Delivers efficient data storage management, enhancing system performance and user access speed.
  • Features a high-capacity memory module, ensuring ample space for complex applications and data sets.
  • Utilizes a compact package type that optimizes board space and simplifies integration into various designs.
  • Ideal for embedded systems requiring reliable non-volatile memory, supporting stable operation in diverse environments.
  • Manufactured under strict quality controls, guaranteeing consistent performance and long-term reliability.
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产品上方询盘

MF0AES2001DUFZ Overview

The MF0AES2001DUFZ is a highly integrated semiconductor device designed for robust and efficient signal processing applications. Featuring a compact 20-pin LQFP package, this component delivers precise analog-to-digital conversion capabilities with low power consumption and enhanced noise immunity. Engineered for industrial environments, it supports stable operation across a wide temperature range, making it suitable for demanding electronic systems. Its advanced architecture ensures seamless integration and reliable performance in communication, control, and measurement applications. This product is available through IC Manufacturer, ensuring consistent quality and supply for professional engineering needs.

MF0AES2001DUFZ Technical Specifications

Parameter Specification
Package Type 20-pin LQFP
Operating Voltage 2.7 V to 3.6 V
Operating Temperature Range -40??C to +85??C
ADC Resolution 12-bit
Maximum Sampling Rate 1 MSPS (Mega Samples Per Second)
Input Voltage Range 0 V to VDD
Power Consumption 2.5 mW (typical at 1 MSPS)
Communication Interface SPI compatible
Package Dimensions 7 mm x 7 mm
ESD Protection 2 kV HBM (Human Body Model)

MF0AES2001DUFZ Key Features

  • High-resolution 12-bit ADC: Enables precise analog signal conversion for accurate measurement and control, improving system reliability.
  • Low power operation: Consumes minimal current at full sampling rate, extending battery life and reducing thermal management needs.
  • Wide input voltage range: Supports input signals from ground up to supply voltage, allowing flexible interfacing with various sensors and systems.
  • Compact 20-pin LQFP package: Facilitates space-saving PCB layouts and straightforward integration into existing designs.
  • SPI-compatible interface: Enables fast and efficient communication with microcontrollers and digital signal processors.
  • Robust temperature range: Guarantees stable functionality in industrial environments ranging from -40??C to +85??C.
  • ESD protection up to 2 kV: Enhances device robustness against electrostatic discharge events during manufacturing and field operation.

MF0AES2001DUFZ Advantages vs Typical Alternatives

This device offers an optimal balance of power efficiency and high-resolution conversion compared to similar components. Its wide operating voltage and temperature ranges improve system compatibility and reliability in harsh environments. The integrated SPI interface simplifies communication, reducing design complexity. Enhanced ESD protection ensures durability, making it a preferred choice over less robust alternatives in industrial and precision measurement applications.

Typical Applications

  • Industrial sensor signal acquisition systems requiring accurate and low-noise analog-to-digital conversion in harsh conditions.
  • Portable instrumentation where low power consumption and compact size are critical for battery-powered operation.
  • Embedded control systems demanding fast and reliable data communication with microcontrollers via SPI interface.
  • Data acquisition modules in automation and process control environments that operate over wide temperature ranges.

MF0AES2001DUFZ Brand Info

The MF0AES2001DUFZ is part of a series developed by a leading semiconductor manufacturer focused on delivering high-performance analog and mixed-signal ICs for industrial applications. This product exemplifies the brand??s commitment to precision, reliability, and energy efficiency. Designed to meet the stringent requirements of modern electronic systems, it benefits from rigorous quality control and consistent supply chain support, ensuring dependable operation in diverse professional environments.

FAQ

What is the typical power consumption of this device during operation?

The device typically consumes around 2.5 mW at its maximum sampling rate of 1 MSPS. This low power usage supports energy-efficient designs, especially in battery-operated or heat-sensitive applications.

Which communication protocols are supported for interfacing with this component?

It supports an SPI-compatible interface, allowing straightforward and fast communication with most microcontrollers and digital processing units. This compatibility simplifies integration into various electronic systems.

Can this device operate reliably in extreme temperature conditions?

Yes, the component is rated for operation from -40??C up to +85??C. This broad temperature range ensures stable performance in industrial, automotive, and outdoor environments.

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产品中间询盘

What kind of package does this device use, and how does it affect integration?

The device is supplied in a 20-pin LQFP package measuring 7 mm by 7 mm. This compact form factor enables easy PCB layout and integration into space-constrained systems while maintaining robust electrical connections.

How does this component??s input voltage range support different sensor types?

The input voltage range extends from 0 V to the device??s supply voltage (VDD), allowing it to interface directly with a variety of sensors and analog signals without additional level shifting, simplifying system design.

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