SL2S2602FUD/BGZ Overview
The SL2S2602FUD/BGZ is a highly integrated semiconductor device designed for efficient voltage regulation and power management in industrial applications. Featuring dual synchronous MOSFETs and advanced control circuitry, this component delivers optimized switching performance and minimal power loss. Its compact package and robust electrical characteristics make it ideal for engineers seeking reliable and space-saving solutions in DC/DC conversion tasks. Available from IC Manufacturer, the device supports high-frequency operation and thermal management, ensuring stable performance in demanding environments.
SL2S2602FUD/BGZ Technical Specifications
| Parameter | Specification |
|---|---|
| Input Voltage Range | 4.5 V to 26 V |
| Maximum Continuous Drain Current | 20 A |
| RDS(on) (High-side MOSFET) | 4.5 m?? @ 10 V |
| RDS(on) (Low-side MOSFET) | 2.5 m?? @ 10 V |
| Operating Frequency | Up to 3 MHz |
| Thermal Resistance (Junction-to-Ambient) | 35 ??C/W |
| Package Type | PowerDFN 5×6 mm |
| Maximum Operating Temperature | 125 ??C |
SL2S2602FUD/BGZ Key Features
- Dual Synchronous MOSFETs: Enables high-efficiency synchronous rectification, reducing conduction losses and improving overall power conversion efficiency.
- Wide Input Voltage Range: Supports input voltages from 4.5 V to 26 V, allowing flexible use in various industrial power systems and battery-powered applications.
- Low RDS(on) Values: Minimizes power dissipation during switching, enhancing thermal performance and reliability under continuous operation.
- High Switching Frequency Capability: Operates up to 3 MHz, enabling compact designs with smaller external components and faster transient response.
- Compact PowerDFN Package: Small footprint reduces PCB space requirements, supporting high-density designs and improving thermal dissipation through optimized layout.
- Robust Thermal Characteristics: Designed to operate at temperatures up to 125 ??C, ensuring dependable function in harsh or high-temperature industrial environments.
SL2S2602FUD/BGZ Advantages vs Typical Alternatives
This device delivers superior efficiency through its low on-resistance MOSFETs and synchronous rectification, outperforming typical discrete MOSFET solutions. Its extended input voltage range and high switching frequency allow for flexible and compact power system designs. Compared to conventional regulators, it offers enhanced thermal management and integration, reducing system complexity and increasing reliability in industrial applications.
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Typical Applications
- High-performance DC/DC converters in industrial power management systems, where efficient voltage regulation and power density are critical for system optimization.
- Battery-powered mobile devices requiring compact and efficient power stages to extend battery life and reduce heat generation.
- Embedded computing platforms that demand stable voltage rails with minimal electromagnetic interference and fast transient response.
- Automotive electronics, where robust operation under wide temperature and voltage variations is essential for reliable system function.
SL2S2602FUD/BGZ Brand Info
This product is part of the IC Manufacturer??s portfolio of advanced power management solutions. Engineered with a focus on integration and efficiency, it reflects the brand??s commitment to delivering reliable semiconductor components tailored for industrial and automotive sectors. The device exemplifies the manufacturer??s expertise in developing high-performance MOSFET drivers and synchronous rectifiers, backed by rigorous quality standards and comprehensive technical support.
FAQ
What is the maximum current this device can handle continuously?
The device supports a continuous drain current of up to 20 A, making it suitable for applications requiring substantial power delivery while maintaining efficiency and thermal stability.
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Can the device operate at high switching frequencies?
Yes, it is designed to operate at switching frequencies up to 3 MHz. This capability allows designers to use smaller passive components, resulting in more compact and responsive power supply designs.
What packaging options are available for this device?
It is supplied in a PowerDFN package measuring 5×6 mm. This package type balances compact size with effective thermal dissipation, facilitating integration into dense PCB layouts.
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How does the device handle thermal management in demanding environments?
The component has a junction-to-ambient thermal resistance of approximately 35 ??C/W and can operate reliably up to 125 ??C. This makes it well-suited for industrial settings where ambient temperatures can be elevated.
Is this device compatible with low voltage input sources?
Yes, it supports input voltages as low as 4.5 V, making it compatible with a wide range of power sources including battery packs and regulated supply rails commonly found in industrial and portable electronics.
