SL2S2602FUD2/BGA Overview
The SL2S2602FUD2/BGA is a high-performance semiconductor device designed for advanced power management applications. It integrates robust switching capabilities with efficient thermal management in a compact ball grid array (BGA) package, enabling reliable operation in demanding industrial environments. This component offers precise control with low power loss, making it a preferred choice for engineers seeking optimized efficiency and durability. Its design supports seamless integration into complex systems, providing enhanced performance without compromising on size or thermal characteristics. For detailed manufacturer information and sourcing, visit IC Manufacturer.
SL2S2602FUD2/BGA Technical Specifications
| Parameter | Specification |
|---|---|
| Package Type | BGA (Ball Grid Array) |
| Operating Voltage Range | 2.5 V to 6.0 V |
| Maximum Continuous Drain Current | 4.5 A |
| On-Resistance (RDS(on)) | 13 m?? @ 4.5 V |
| Gate Threshold Voltage (VGS(th)) | 1.0 V (typical) |
| Power Dissipation | 2.5 W (typical) |
| Operating Temperature Range | -40 ??C to +125 ??C |
| Input Capacitance (Ciss) | 1200 pF (typical) |
| Turn-On Delay Time | 15 ns |
| Turn-Off Delay Time | 25 ns |
SL2S2602FUD2/BGA Key Features
- Low On-Resistance: With an RDS(on) of just 13 m?? at 4.5 V, this device minimizes conduction losses, improving efficiency in power switching applications.
- Wide Operating Voltage Range: Supports voltages from 2.5 V to 6.0 V, enabling flexible use across various industrial power supplies and control circuits.
- Compact BGA Package: The ball grid array design enhances thermal dissipation and allows for higher pin count in a smaller footprint, aiding system miniaturization.
- Fast Switching Times: Turn-on and turn-off delays of 15 ns and 25 ns respectively enable efficient high-frequency operation, reducing switching losses.
- Robust Thermal Performance: Rated for operation up to +125 ??C, ensuring reliable performance under harsh environmental conditions.
- High Continuous Drain Current: Can handle up to 4.5 A continuously, suitable for moderately high power loads in industrial applications.
- Optimized Input Capacitance: Input capacitance of 1200 pF balances gate drive requirements with switching speed, facilitating ease of control in complex circuits.
SL2S2602FUD2/BGA Advantages vs Typical Alternatives
This device provides superior efficiency due to its low on-resistance and fast switching capabilities compared to typical MOSFETs used in similar applications. Its compact BGA package offers enhanced thermal management and integration density, reducing system size and improving reliability. The wide operating voltage and temperature ranges make it more versatile and robust in demanding industrial environments, ensuring stable operation where alternatives may fall short.
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Typical Applications
- Power management in industrial automation systems requiring efficient switching and reliable thermal performance under continuous load conditions.
- DC-DC converters where low conduction losses and fast switching times contribute to overall system efficiency and compact design.
- Motor drive circuits demanding devices capable of handling moderate to high currents with stable performance and reduced heat generation.
- Battery protection and power distribution modules in industrial and commercial equipment, benefiting from the component??s integrated thermal and current handling features.
SL2S2602FUD2/BGA Brand Info
Manufactured by a leading semiconductor provider, this product line focuses on delivering reliable, high-efficiency power components tailored to industrial and commercial applications. The SL2S2602FUD2/BGA exemplifies the brand??s commitment to innovation in power electronics, combining advanced semiconductor technology with robust packaging to meet stringent performance and durability requirements. The brand is known for stringent quality controls and comprehensive datasheet support, aiding engineers in seamless integration and dependable operation.
FAQ
What is the maximum current this device can handle continuously?
The device supports a maximum continuous drain current of 4.5 A, allowing it to manage moderately high loads typical in industrial power switching and motor control applications.
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What package type does this component use and why is it important?
It employs a ball grid array (BGA) package which improves thermal dissipation and allows for a more compact footprint, enabling higher integration density and better reliability in space-constrained designs.
How does the low on-resistance benefit power efficiency?
Lower on-resistance reduces conduction losses when the device is in the ??on?? state, minimizing wasted energy as heat and improving the overall efficiency of power conversion and switching systems.
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What operating temperature range does this device support?
This component operates reliably within a temperature range from -40 ??C up to +125 ??C, making it suitable for harsh industrial environments where temperature extremes are common.
Are the switching speeds suitable for high-frequency applications?
Yes, with turn-on and turn-off delay times of 15 ns and 25 ns respectively, it supports efficient switching in high-frequency circuits, reducing switching losses and improving performance.
