PN5331B3HN/C270,55 High-Performance Processor Module – Compact Pack

  • Enables accurate signal processing for enhanced device performance and user interaction.
  • Features a high-frequency operation that supports fast data transfer rates critical for real-time applications.
  • Compact package type reduces board space, allowing for efficient integration into small form-factor devices.
  • Ideal for embedded systems requiring reliable communication between components in constrained environments.
  • Built with robust manufacturing standards to ensure consistent operation and long-term durability.
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产品上方询盘

PN5331B3HN/C270,55 Overview

The PN5331B3HN/C270,55 is a high-performance semiconductor device designed for advanced industrial and electronic applications requiring precision and reliability. Engineered to deliver stable operation under varying conditions, it supports seamless integration within complex systems. This component offers robust electrical characteristics suited for demanding environments, providing engineers and sourcing specialists with a dependable solution for their design needs. For detailed technical support and sourcing options, visit IC Manufacturer.

PN5331B3HN/C270,55 Technical Specifications

Parameter Specification
Package Type QFN, 32-pin
Operating Voltage 2.7 V to 3.6 V
Operating Temperature Range -40??C to +85??C
Maximum Clock Frequency 26 MHz
Communication Interface I2C, SPI
Power Consumption Typical 15 mA in active mode
Memory Size 64 KB Flash
Package Dimensions 5 mm ?? 5 mm ?? 0.9 mm

PN5331B3HN/C270,55 Key Features

  • High-speed communication interfaces: Supports both I2C and SPI protocols, enabling flexible and fast data exchange for diverse system architectures.
  • Wide operating voltage range: Operates reliably between 2.7 V and 3.6 V, ensuring compatibility with various power supply designs and enhancing system robustness.
  • Compact QFN package: The 5 mm square footprint allows for efficient PCB space utilization without compromising thermal performance or mechanical stability.
  • Extended temperature tolerance: Certified to function in industrial temperature ranges from -40??C to +85??C, suitable for harsh environmental conditions.
  • Low power consumption: Typical active mode current of 15 mA supports energy-efficient system designs, beneficial for battery-operated or low-power applications.
  • Ample embedded memory: 64 KB Flash memory provides sufficient storage for firmware and configuration data, simplifying system updates and customization.
  • High-frequency operation: Up to 26 MHz clock frequency enables fast processing speeds, supporting time-critical industrial tasks.

PN5331B3HN/C270,55 Advantages vs Typical Alternatives

This device offers a superior balance of power efficiency and processing speed compared to standard components in the same class. Its wide operating voltage and temperature ranges provide enhanced reliability in industrial settings. Additionally, the compact QFN packaging and dual communication interfaces enable easier integration and flexible system design, making it an optimal choice over typical alternatives with limited interface support or larger footprints.

Typical Applications

  • Industrial control systems requiring robust communication interfaces and reliable operation in harsh temperature environments, ensuring precise control and monitoring.
  • Embedded systems where low power consumption and compact size are critical for performance and design constraints.
  • Consumer electronics that demand high-speed data processing and efficient memory usage to support firmware updates and feature enhancements.
  • Automotive electronics applications benefiting from extended temperature tolerance and stable operation under varying voltage supply conditions.

PN5331B3HN/C270,55 Brand Info

This product is part of an advanced semiconductor portfolio designed to meet the stringent requirements of industrial and embedded applications. The manufacturer focuses on delivering high-quality, reliable components that support modern electronics with scalable performance and ease of integration. The PN5331B3HN/C270,55 exemplifies the brand??s commitment to innovation, combining precision engineering and robust design to facilitate efficient product development and long-term operational stability.

FAQ

What communication interfaces does this component support?

The device supports both I2C and SPI communication protocols. These interfaces allow flexible integration into various system architectures, providing high-speed and reliable data transfer for industrial and embedded applications.

What is the typical power consumption in active mode?

Typical current consumption is approximately 15 mA during active operation. This low power usage makes it suitable for energy-conscious designs, particularly in portable or battery-powered devices.

Can the device operate in extreme temperature conditions?

Yes, it is designed to operate reliably within a temperature range from -40??C to +85??C. This makes it suitable for industrial and automotive environments where temperature extremes are common.

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产品中间询盘

What package type and size does this product use?

The component comes in a 32-pin QFN package, measuring 5 mm by 5 mm with a height of 0.9 mm. This compact form factor supports high-density PCB layouts while maintaining good thermal characteristics.

Is the embedded memory sufficient for firmware updates?

With 64 KB of Flash memory, the device offers ample space to store firmware and configuration data, facilitating system customization and remote updates without requiring external memory components.

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