PS-D4C26 Overview
The PS-D4C26 is a high-performance semiconductor device designed for precision industrial applications. It offers robust operation with a focus on reliability and accuracy, making it suitable for demanding environments. With advanced integration and optimized power consumption, this component supports efficient system design and long-term stability. Engineers and sourcing specialists will find the PS-D4C26 an ideal choice for applications requiring consistent performance under varying conditions. For detailed product information and procurement, visit IC Manufacturer.
PS-D4C26 Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Voltage Range | 4.5 V to 5.5 V |
| Maximum Operating Temperature | +85??C |
| Minimum Operating Temperature | -40??C |
| Power Consumption | Typical 120 mW |
| Package Type | QFN-24 |
| Input Signal Range | 0 to 3.3 V |
| Output Current | Max 50 mA |
| Interface Compatibility | I2C and SPI |
PS-D4C26 Key Features
- High Integration Level: Combines multiple functions into a single compact package, reducing board space and simplifying system design.
- Wide Operating Voltage Range: Supports 4.5 V to 5.5 V, allowing flexible deployment in various industrial power supply environments.
- Low Power Consumption: Optimized for energy efficiency, enabling longer device lifespan and reduced thermal stress.
- Robust Thermal Performance: Rated for operation from -40??C to +85??C, ensuring reliable function in harsh temperature conditions.
PS-D4C26 Advantages vs Typical Alternatives
The device stands out with its balanced combination of low power consumption and wide temperature tolerance, which enhances reliability in industrial settings. Its integrated interface support for both I2C and SPI protocols offers greater flexibility compared to typical single-interface alternatives. Additionally, the compact QFN-24 package provides superior thermal management and ease of assembly, making it a preferred choice for engineers seeking efficient, durable semiconductor components.
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Typical Applications
- Industrial automation equipment requiring precise control signals and stable operation in temperature-variable environments, ensuring consistent performance and system integrity.
- Embedded control systems where low power consumption and compact form factor directly impact device efficiency and space constraints.
- Signal conditioning modules that benefit from the device??s wide input voltage range and multi-interface compatibility.
- Power management units in industrial electronics, leveraging the device??s robust thermal rating and reliable output current capacity.
PS-D4C26 Brand Info
The PS-D4C26 is a specialized semiconductor product offered by a leading IC manufacturer known for its commitment to quality and innovation in industrial technology. This product line emphasizes precision, durability, and integration, catering specifically to the needs of engineers and sourcing professionals in demanding industrial markets. The brand??s legacy in delivering reliable components ensures that the PS-D4C26 meets stringent performance standards and supports complex application requirements with confidence.
FAQ
What voltage levels does the PS-D4C26 support for operation?
The device operates within a voltage range of 4.5 V to 5.5 V, making it compatible with common industrial power supplies. This range allows for stable performance while accommodating slight fluctuations in input voltage.
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Can the PS-D4C26 operate in extreme temperature conditions?
Yes, it is rated for operation from -40??C to +85??C, which covers a broad spectrum of industrial environments. This thermal capability ensures dependable operation even under harsh temperature variations.
What communication interfaces are supported by this device?
The PS-D4C26 supports both I2C and SPI interfaces. This dual compatibility provides flexibility for integration into various system architectures and facilitates easier communication with microcontrollers and other digital devices.
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How does the package type benefit system design?
The QFN-24 package offers a compact footprint and enhanced thermal dissipation. This helps reduce board space requirements and




