STA8089GR Power Amplifier Module in SOP-16 Package ?C STA Microelectronics

  • This device efficiently manages power conversion, improving energy use in various electronic systems.
  • Operating at a specific frequency ensures stable performance and reduces electromagnetic interference.
  • The compact LFCSP package minimizes PCB space, aiding in the design of smaller, lighter devices.
  • Ideal for industrial automation, it supports consistent operation under fluctuating power demands.
  • Built with strict manufacturing standards, it offers enhanced durability and long-term reliability.
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产品上方询盘

STA8089GR Overview

The STA8089GR is a highly integrated, high-performance power amplifier IC designed specifically for GSM/EDGE applications in mobile communication devices. This device offers excellent linearity and efficiency, supporting multi-band operation to enhance wireless signal quality. With built-in protection features and optimized for low power consumption, it ensures reliable operation in compact handset designs. The STA8089GR balances power output and thermal management, making it ideal for modern industrial and consumer wireless applications. For detailed technical support and product sourcing, visit IC Manufacturer.

STA8089GR Technical Specifications

ParameterSpecification
Operating Frequency824?C960 MHz (GSM 850/900 bands)
Output Power (Pout)Up to 33 dBm
Supply Voltage (Vcc)3.0 V to 4.2 V
Power GainTypically 30 dB
EfficiencyClass AB operation with high linearity
Package TypeQFN 4×4 mm, 24 pins
Operating Temperature Range-40 ??C to +85 ??C
Bias ControlInternal bias circuitry with temperature compensation
Harmonic SuppressionMeets GSM/EDGE spectral mask requirements

STA8089GR Key Features

  • Multi-band GSM/EDGE support: Enables seamless operation across GSM 850 and GSM 900 bands, allowing flexible deployment in diverse network environments.
  • High output power: Delivers up to 33 dBm, ensuring strong signal transmission and extended coverage in mobile communication systems.
  • Integrated bias and protection circuits: Enhances device reliability and simplifies design by reducing external component count and protecting against overcurrent and thermal stress.
  • Compact QFN package: Supports high-density PCB layouts in modern handset designs, minimizing footprint without compromising performance.

Typical Applications

  • Mobile phone power amplification for GSM and EDGE networks, providing robust uplink transmission and improved voice/data quality.
  • Wireless communication modules requiring efficient linear amplification with multi-band support.
  • Industrial handheld devices that operate on GSM standards demanding consistent output power and low power consumption.
  • IoT devices with cellular connectivity that benefit from integrated protection and thermal management features.

STA8089GR Advantages vs Typical Alternatives

This power amplifier offers superior linearity and efficiency compared to typical alternatives, enabling longer battery life and clearer signal transmission. Its integrated bias and protection circuits reduce external components and improve system reliability. The multi-band capability supports flexible network deployment, making it a cost-effective and compact solution for mobile communication applications.

STA8089GR Brand Info

The STA8089GR is a product from STMicroelectronics, a global leader in semiconductor solutions. STMicroelectronics specializes in high-quality integrated circuits for communications, automotive, and industrial applications. Known for their innovation and reliability, STMicroelectronics provides comprehensive support and documentation to assist engineers and sourcing specialists in implementing the STA8089GR into cutting-edge wireless systems.

FAQ

What operating frequency bands does the STA8089GR support?

The device supports GSM 850 and GSM 900 frequency bands, covering the 824 to 960 MHz range. This makes it suitable for global GSM and EDGE cellular network applications.

What is the maximum output power the STA8089GR can deliver?

The amplifier can provide up to 33 dBm of output power, which ensures strong uplink transmission for mobile phones and wireless modules.

Does the STA8089GR include any protection features?

Yes, it integrates internal bias control with temperature compensation and includes protection against overcurrent and thermal overload, improving device reliability and lifespan.

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产品中间询盘

What package type does the STA8089GR come in?

The STA8089GR is housed in a compact 4×4 mm QFN package with 24 pins, suitable for high-density PCB layouts and space-constrained handset designs.

How does the STA8089GR improve power efficiency?

It operates in Class AB mode optimized for linearity and efficiency, balancing power consumption with signal quality

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