STA709TR Overview
The STA709TR is a high-performance integrated circuit designed for efficient power management in audio amplification applications. It features robust output capabilities, low distortion, and thermal protection, making it suitable for demanding industrial and consumer audio environments. This device supports high output power with minimal external components, simplifying design complexity and reducing overall system cost. Its compact footprint and reliable operation under varying load conditions ensure consistent audio quality and system stability. For engineers and sourcing specialists seeking dependable amplification solutions, the STA709TR offers an optimal balance of performance and integration. For more details, visit IC Manufacturer.
STA709TR Technical Specifications
| Parameter | Specification |
|---|---|
| Supply Voltage (VCC) | 14.4 V (typical) |
| Output Power (Pout) | 22 W (at THD = 10%, RL = 4??) |
| Total Harmonic Distortion (THD) | 0.1% (typical at 1 kHz, 1 W output) |
| Load Resistance | 4 ?? to 8 ?? |
| Quiescent Current (IQ) | 40 mA (typical) |
| Frequency Response | 20 Hz to 20 kHz (??1 dB) |
| Thermal Shutdown | Included for device protection |
| Package Type | Multiwatt15 |
STA709TR Key Features
- High Output Power Capability: Delivers up to 22 W into 4 ?? load, enabling clear and powerful audio reproduction in compact systems.
- Low Distortion Performance: Maintains THD as low as 0.1%, ensuring high-fidelity sound quality ideal for professional and consumer audio devices.
- Integrated Thermal Protection: Prevents device damage by automatically shutting down during overheating, enhancing reliability and safety.
- Wide Operating Voltage Range: Supports typical supply voltage of 14.4 V, making it adaptable for automotive and portable audio applications.
Typical Applications
- Car audio amplification systems requiring high output power and low distortion for enhanced sound performance in automotive environments.
- Portable speaker systems where compact size and efficient power usage are critical for battery-powered operation.
- Home audio equipment that demands reliable thermal management and consistent audio fidelity over extended use.
- Industrial audio signaling devices needing robust output and protection features for harsh operational conditions.
STA709TR Advantages vs Typical Alternatives
This device stands out due to its combination of high output power and low total harmonic distortion, providing superior audio clarity compared to many alternatives. Its integrated thermal shutdown enhances reliability, reducing the risk of failure in critical applications. Additionally, the broad operating voltage range and compact Multiwatt15 package simplify system design and integration, making it a cost-effective choice for engineers focused on durability and performance.
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STA709TR Brand Info
The STA709TR is produced by STMicroelectronics, a global leader in semiconductor manufacturing. Known for their innovation in power management and audio amplification ICs, STMicroelectronics designs this product to meet stringent industrial and consumer audio standards. The STA709TR benefits from ST??s extensive experience in analog and mixed-signal semiconductor technologies, ensuring high-quality performance, robust protection features, and ease of integration into diverse audio systems.
FAQ
What is the maximum output power of the STA709TR?
The maximum output power of the device is approximately 22 watts into a 4-ohm load at a total harmonic distortion (THD) of 10%. This makes it suitable for delivering clear and powerful audio signals in mid-power amplification applications.
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Does the STA709TR include any protection features?
Yes, the IC integrates thermal shutdown protection, which safeguards the device against overheating. This feature enhances reliability by preventing damage during abnormal thermal conditions, ensuring stable operation in various environments.
What package type does this IC use, and how does it affect integration?
The component comes in a Multiwatt15 package, which supports efficient heat dissipation and simplifies mounting on printed circuit boards. This compact package type facilitates easier integration into systems where space and thermal management are important.
