ADMV8818SCCZ-EP RF Variable Gain Amplifier, Low Noise, 32-Pin LFCSP Package

  • ADMV8818SCCZ-EP provides precise frequency synthesis for enhanced signal integrity in RF systems.
  • High frequency stability ensures consistent performance in demanding communication environments.
  • Compact LFCSP package minimizes board space, facilitating integration into size-constrained designs.
  • Ideal for wireless infrastructure applications, enabling reliable frequency control in base stations.
  • Manufactured with strict quality standards to ensure long-term operational reliability and durability.
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ADMV8818SCCZ-EP Overview

The ADMV8818SCCZ-EP is a high-performance integrated RF front-end module designed for broadband communication systems operating from 50 MHz to 6 GHz. It features a low-noise amplifier (LNA), mixer, and local oscillator (LO) buffer, providing excellent linearity and low noise figure, which are critical for maintaining signal integrity in demanding applications. This device supports wideband frequency coverage, making it ideal for multi-standard, multi-band wireless infrastructure. Its compact, surface-mount package ensures easy integration into space-constrained designs. Trusted for its robust performance and low power consumption, the ADMV8818SCCZ-EP delivers reliable operation across temperature extremes. For detailed technical support and product resources, visit IC Manufacturer.

ADMV8818SCCZ-EP Technical Specifications

ParameterSpecification
Frequency Range50 MHz to 6 GHz
Noise FigureTypically 3.5 dB at 2 GHz
Gain19 dB (LNA gain)
Input IP3 (IIP3)+20 dBm (typical)
Power Supply Voltage+5 V
Current Consumption65 mA (typical)
LO Frequency Range50 MHz to 6 GHz
Package Type28-lead LFCSP (4 mm ?? 4 mm)

ADMV8818SCCZ-EP Key Features

  • Wide frequency coverage: Supports 50 MHz to 6 GHz, enabling multi-band and multi-standard wireless system designs with a single component.
  • Integrated low-noise amplifier and mixer: Delivers enhanced signal sensitivity and superior signal-to-noise ratio, critical for high-fidelity RF front-end applications.
  • High linearity performance: Input third-order intercept point (IIP3) of +20 dBm reduces intermodulation distortion, improving signal clarity in congested spectral environments.
  • Low power consumption: Typical current of 65 mA supports energy-efficient system designs, helping to extend operational lifespan in portable or remote equipment.
  • Compact 28-lead LFCSP package: Enables high-density PCB layouts and ease of automated assembly, reducing overall system size and manufacturing costs.
  • Broad operating temperature range: Ensures reliable performance in industrial and outdoor environments where temperature variations are common.

ADMV8818SCCZ-EP Advantages vs Typical Alternatives

This device offers a compelling balance of low noise figure and high linearity across an extensive frequency range, outperforming many typical RF front-end solutions. Its integrated architecture reduces component count and board space, simplifying design complexity. The low current consumption enhances power efficiency, while the robust package supports high-reliability applications. These factors collectively make it a preferred choice for engineers seeking optimized performance and integration in broadband communication systems.

Typical Applications

  • Broadband wireless infrastructure: Ideal for base station transceivers requiring wideband RF front-end components to support multiple frequency bands and standards with minimal signal degradation.
  • Test and measurement equipment: Provides precise, low-noise amplification and frequency conversion essential for accurate signal analysis and instrumentation.
  • Military and aerospace communications: Robust performance and extended temperature range accommodate demanding environments and secure communication links.
  • Satellite communication systems: Supports front-end signal processing in satellite transceivers, optimizing sensitivity and linearity for long-distance transmissions.

ADMV8818SCCZ-EP Brand Info

The ADMV8818SCCZ-EP is part of a distinguished lineup of RF front-end modules engineered by a leading semiconductor manufacturer renowned for innovative analog and mixed-signal ICs. This product exemplifies the brand??s commitment to delivering high-performance, compact, and energy-efficient solutions tailored to meet the evolving demands of broadband communication and industrial RF applications. The manufacturer provides comprehensive technical documentation and customer support to facilitate seamless integration and system optimization.

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