JANKCBL2N2906A-Transistor-Die Overview
The JANKCBL2N2906A-Transistor-Die is a high-performance PNP bipolar junction transistor die optimized for amplification and switching applications. Designed with robust electrical characteristics, it delivers reliable operation under varied thermal and electrical stress conditions. This transistor die offers excellent current handling capability and voltage tolerance, making it suitable for integration into discrete component packages or hybrid circuits. Its compact die form factor supports efficient thermal dissipation and ease of assembly in industrial electronics. For engineers and sourcing specialists seeking a dependable transistor die, IC Manufacturer provides precise manufacturing standards ensuring consistent quality and performance.
JANKCBL2N2906A-Transistor-Die Technical Specifications
| Parameter | Specification |
|---|---|
| Transistor Type | PNP Bipolar Junction Transistor (BJT) |
| Collector-Emitter Voltage (Vce) | Up to 40 V |
| Collector Current (Ic) | Up to 600 mA |
| Power Dissipation (Pd) | Up to 625 mW (at die level) |
| Current Gain (hFE) | Typical range 100 to 300 |
| Transition Frequency (fT) | Up to 100 MHz |
| Base-Emitter Voltage (Vbe) | Typical 0.7 V at 10 mA |
| Die Dimensions | Approximately 1.2 mm ?? 1.5 mm |
| Package Type | Bare Die (for hybrid assembly) |
JANKCBL2N2906A-Transistor-Die Key Features
- High current handling capability: Supports collector currents up to 600 mA, enabling robust switching and amplification in power-sensitive circuits.
- Excellent voltage tolerance: Collector-emitter voltage rating up to 40 V allows use in medium-voltage industrial control applications.
- Compact bare die format: Facilitates efficient thermal management and integration into custom hybrid modules or multi-chip assemblies.
- Consistent gain performance: Current gain (hFE) stability across operating conditions enhances circuit predictability and design accuracy.
Typical Applications
- Signal amplification in audio and industrial control circuits where reliable linear gain is required.
- Switching elements in low to medium power DC-DC converters and power management modules.
- Discrete transistor replacement in legacy designs requiring PNP transistor dies for repair or custom assembly.
- Integration into hybrid IC packages for automotive and telecommunications equipment due to its compact size and electrical robustness.
JANKCBL2N2906A-Transistor-Die Advantages vs Typical Alternatives
This transistor die offers superior current capacity and voltage tolerance compared to many standard PNP dies, enhancing circuit reliability under demanding conditions. Its bare die form allows for flexible integration and improved thermal dissipation, unlike fully packaged transistors. The stable current gain and high transition frequency provide better signal fidelity and switching speed. These advantages translate into improved efficiency and durability in industrial and commercial electronics.
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JANKCBL2N2906A-Transistor-Die Brand Info
The JANKCBL2N2906A-Transistor-Die is manufactured under stringent quality controls by a reputable semiconductor producer specializing in discrete transistor dies and custom semiconductor components. This product line focuses on delivering high-performance bipolar transistors tailored for industrial, automotive, and consumer electronics markets. The brand upholds rigorous wafer fabrication and die testing processes, ensuring reliable electrical characteristics and die integrity for downstream assembly and integration.
FAQ
What is the maximum collector current rating for this transistor die?
The collector current rating is up to 600 mA, which allows the transistor to handle moderate power levels suitable for amplification and switching in industrial applications.
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Can this transistor die be used in high-frequency circuits?
Yes, with a transition frequency (fT) up to 100 MHz, it is capable of operating effectively in moderate high-frequency applications such as RF amplifiers and switching regulators.
Is the die suitable for custom packaging or hybrid integration?
Absolutely, the bare die format is intended for use in hybrid circuits or custom packaging solutions, facilitating efficient thermal management and flexible







