JANKCBL2N3700-Transistor-Die Overview
The JANKCBL2N3700-Transistor-Die is a high-performance bipolar junction transistor die designed for integration into advanced semiconductor assemblies. This device offers reliable switching and amplification capabilities with well-defined electrical parameters suitable for industrial and electronic engineering applications. Its die format allows for customized packaging and integration, providing flexibility in circuit design and optimization. Ideal for engineers and sourcing specialists requiring compact, efficient transistor solutions, this transistor die supports robust electrical performance and consistent quality. For more detailed product and sourcing information, visit IC Manufacturer.
JANKCBL2N3700-Transistor-Die Key Features
- High Current Handling: Supports collector current up to 200mA, enabling effective power amplification in medium-load circuits.
- Voltage Endurance: Collector-emitter voltage withstands up to 60V, ensuring reliable operation in standard switching applications.
- Die Format Flexibility: Unpackaged transistor die allows seamless integration into custom semiconductor modules, benefiting system-level design customization.
- Thermal Performance: Silicon die construction provides stable operation under varied thermal conditions, enhancing device reliability.
JANKCBL2N3700-Transistor-Die Technical Specifications
| Parameter | Specification |
|---|---|
| Transistor Type | NPN Bipolar Junction Transistor |
| Collector-Emitter Voltage (VCE) | 60V (max) |
| Collector Current (IC) | 200mA (max) |
| Power Dissipation (Ptot) | Variable depending on packaging, die only |
| Gain Bandwidth Product (fT) | Typically 100MHz (die level typical value) |
| Base-Emitter Voltage (VBE) | 0.7V (typical forward voltage) |
| Package Type | Unpackaged Silicon Die |
| Operating Temperature Range | -55??C to +150??C (typical silicon die limits) |
JANKCBL2N3700-Transistor-Die Advantages vs Typical Alternatives
This transistor die offers enhanced design flexibility compared to packaged transistors, allowing engineers to optimize thermal management and circuit layout. Its robust voltage and current ratings provide reliable performance in switching and amplification tasks. The unpackaged format reduces parasitic elements common in typical transistor packages, improving high-frequency response and integration in custom semiconductor assemblies.
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Typical Applications
- Signal amplification in analog circuits where die-level customization boosts performance and integration density.
- Switching applications in industrial control systems requiring reliable medium-power transistor operation.
- Embedded semiconductor modules needing compact, efficient transistor components for power management.
- Custom hybrid integrated circuits where transistor die integration enhances overall device miniaturization and thermal handling.
JANKCBL2N3700-Transistor-Die Brand Info
The JANKCBL2N3700 transistor die is produced by IC Manufacturer, a trusted supplier specializing in high-quality semiconductor components for industrial and electronic applications. This product reflects the brand??s commitment to delivering precise, reliable transistor dies that support advanced circuit design and system integration. The brand emphasizes manufacturing excellence and consistent product performance to meet the stringent requirements of engineers and sourcing professionals worldwide.
FAQ
What type of transistor is the JANKCBL2N3700-Transistor-Die?
The device is an NPN bipolar junction transistor in die form, designed for integration into semiconductor modules or custom packages. It supports fundamental switching and amplification functions typical of NPN transistors.
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What are the maximum voltage and current ratings for this transistor die?
The maximum collector-emitter voltage rating is 60V, while the maximum collector current rating is 200mA. These ratings ensure suitability for moderate power switching and amplification applications.
Can the transistor die be used directly on a PCB?
As an unpackaged die, it requires specialized assembly techniques such as die bonding and wire bonding before integration onto a PCB. It is not suitable for direct soldering without proper packaging or hybrid module assembly.
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What is the typical operating temperature range for this transistor die?
The typical silicon die supports operation from -55??C to +150??C, accommodating a wide range of industrial and environmental conditions, provided the die is correctly mounted and thermally managed.
How does the die format benefit system designers?
The unpackaged transistor die allows for customized packaging solutions, minimal parasitic inductance and capacitance, and improved thermal pathways. This flexibility supports advanced circuit designs requiring compact size and optimized electrical performance.
